My name is Simon Edward Penrowe, I am a machinist and the first person to have used a free abrasive process to improve the surface geometry of a CPU and its water block for the purpose of increasing the thermal conductivity of the system by removing the need for any thermal interface material between the surfaces.

For questions or business inquires contact me at ?

The performance improvements this yields are rather dramatic, this video covers the results of thermal tests conducted on a #Timless system: (This is a placeholder for now, stay tuned)

If you wish to understand the lapping process in detail I also encourage you to watch the following:

The lapping performed by me is accomplished using a set of lapping plates and diamond abrasives, not the usual nonsense involving sand paper which is what non-machinists usually think of when they speak of lapping in the context of PC hardware. In real world terms the difference is that a properly lapped CPU will be at least two orders of magnitude closer to ideal flatness than the best result sandpaper can produce. This is what makes #Timless operation possible.